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DOPO Non-Halogen Reaction Flade Retardants

Non-Halogen reaction flame retardants ya Epoxy resin, ishobora gukoreshwa muri PCB hamwe na semiconductor encapsulation, Anti-umuhondo wumuti wibikorwa bya ABS, PS, PP, Epoxy resin nibindi. Hagati ya flame retardant nindi miti.


  • Izina ry'ibicuruzwa:9,10-dihydro-9-oxa-10-fosifapenanthrene-10-oxyde
  • Inzira ya molekulari:C12H9O2P
  • Uburemere bwa molekile:216.16
  • URUBANZA OYA.:35948-25-5
  • Ibicuruzwa birambuye

    Ibicuruzwa

    Kumenyekanisha ibicuruzwa
    Izina ryibicuruzwa: 9,10-dihydro-9-oxa-10-fosifapenanthrene-10-oxyde
    Amagambo ahinnye: DOPO
    URUBANZA OYA.: 35948-25-5
    Uburemere bwa molekile: 216.16
    Inzira ya molekulari: C12H9O2P
    Imiterere

    DOPO

    Umutungo

    Umubare 1.402 (30 ℃)
    Ingingo yo gushonga 116 ℃ -120 ℃
    Ingingo yo guteka 200 ℃ (1mmHg)

    Icyerekezo cya tekiniki

    Kugaragara ifu yera cyangwa flake yera
    Suzuma (HPLC) ≥99.0%
    P ≥14.0%
    Cl ≤50ppm
    Fe ≤20ppm

    Gusaba
    Non-Halogen reaction flame retardants ya Epoxy resin, ishobora gukoreshwa muri PCB hamwe na semiconductor encapsulation, Anti-umuhondo wumuti wibikorwa bya ABS, PS, PP, Epoxy resin nibindi. Hagati ya flame retardant nindi miti.

    Amapaki
    25 Kg / igikapu.

    Ububiko
    Ubike ahantu hakonje, humye, uhumeka neza, kure ya okiside ikomeye.


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